![]() ![]() Preheating is to heat the PCB to activate the flux and reduce the thermal shock of the PCB in contact with tin wave. After the surface of the printed circuit board is coated with flux, it is heated through the preheating zone at a certain speed. The next step is to apply a thin layer of flux evenly on the surface of the printed circuit board and the leading end of the components. Preparation before welding is mainly used to remove oil pollution, remove oxide film and coated solder. The technological process of wave soldering is: preparing before welding, applying flux, preheating, wave soldering, cooling and cleaning. Wave-peak welding has been used for PCB mounting for more than 20 years, and now has become a very mature electronic mounting technology, which is mainly used for the welding of through-hole mounting components and surface components adopting mixed assembly. Wave soldering refers to the process of soldering all the welding spots on the printed circuit board inserted with the melted solder by wave soldering machine. By analyzing and comparing the defects in the process of wave soldering and reflow welding from the quality control before welding, production process materials and process parameters, thus greatly improving the production process and quality of electronic products. The quality of welding is related to product performance, reliability, service life, etc., and will affect each subsequent process flow. As a kind of traditional welding technology, wave soldering and reflow soldering play an active role in the field of electronic manufacturing in the assembling process of electronic products. ![]()
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